Method for adjusting target object, electronic device, and storage medium

ABSTRACT

Provided is a method for adjusting a target object, an electronic device, and a storage medium, relating to a field of computer technology, and in particular, to fields of intelligent transportation, automatic driving, computer vision, and the like. The method includes: acquiring a first bounding box corresponding to the target object and a second bounding box corresponding to a support of the target object; obtaining an association relationship for adjustment of the target object, according to a spatial position where the first and second bounding boxes are located; and moving, according to the association relationship, the target object towards the support, to obtain a third bounding box corresponding to the adjusted target object, where the third bounding box and the second bounding box appear to fit each other.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application claims the priority of Chinese PatentApplication No. 202210646167.X, filed with the China NationalIntellectual Property Administration on Jun. 8, 2022, the disclosure ofwhich is hereby incorporated herein by reference in its entirety.

TECHNICAL FIELD

The present disclosure relates to a field of computer technology, and inparticular, to fields of intelligent transportation, automatic driving,computer vision, and the like.

BACKGROUND

In a scenario, such as intelligent transportation or automatic driving,it is necessary to detect a target object around a vehicle or a road, toassist a driver to analyze and learn road information, speed limitinginformation, or the like, so as to control a driving behavior of thedriver, such as controlling steering of a steering wheel, braking,accelerating, decelerating. In a driverless scenario, it is alsonecessary to control the steering of the steering wheel, the braking,the accelerating, and/or the decelerating, in combination with thedetected target object.

Under three-dimensional (3D) modeling, there may be errors in thedetection of the target object such as a sign on the road and a supportof the target object, which results in a large number of problems suchas intersection and non-fitting between the target object and thesupport of the target object, thus the target object needs to beadjusted.

SUMMARY

The present disclosure provides a method and apparatus for adjusting atarget object, an electronic device, and a storage medium.

According to an aspect of the present disclosure, provided is a methodfor adjusting a target object, including: acquiring a first bounding boxcorresponding to the target object and a second bounding boxcorresponding to a support of the target object; obtaining anassociation relationship for adjustment of the target object, accordingto a spatial position where the first and second bounding boxes arelocated; and moving, according to the association relationship, thetarget object towards the support, to obtain a third bounding boxcorresponding to the adjusted target, where the third bounding box andthe second bounding box appear to fit each other.

According to another aspect of the present disclosure, provided is anapparatus for adjusting a target object, including: an acquisitionmodule configured to acquire a first bounding box corresponding to thetarget object and a second bounding box corresponding to a support ofthe target object; a relationship determination module configured toobtain an association relationship for adjustment of the target object,according to a spatial position where the first and second boundingboxes are located; and an adjustment module configured to move,according to the association relationship, the target object towards thesupport, to obtain a third bounding box corresponding to the adjustedtarget object, where the third bounding box and the second bounding boxappear to fit each other.

According to another aspect of the present disclosure, provided is anelectronic device, including: at least one processor; and a memoryconnected in communication with the at least one processor. The memorystores an instruction executable by the at least one processor, and theinstruction, when executed by the at least one processor, enables the atleast one processor to execute the method provided by any embodiment ofthe present disclosure.

According to another aspect of the present disclosure, provided is anon-transitory computer-readable storage medium storing a computerinstruction thereon, and the computer instruction is used to cause acomputer to execute the method provided by any embodiment of the presentdisclosure.

According to another aspect of the present disclosure, provided is acomputer program product including a computer program, and the computerprogram implements the method provided by any embodiment of the presentdisclosure, when executed by a processor.

With the present disclosure, the first bounding box corresponding to thetarget object and the second bounding box corresponding to the supportof the target object may be acquired, to obtain the associationrelationship for the adjustment of the target object, according to thespatial position where the first and second bounding boxes are located.The target object may be moved towards the support according to theassociation relationship, to obtain the third bounding box correspondingto the adjusted target object, and the third bounding box and the secondbounding box appear to fit each other. Since the target object in 3Dmodeling may be adjusted accurately, an effect that the target objectand the support of the target object fit each other may be achieved.

It should be understood that the content described in this part is notintended to identify key or important features of embodiments of thepresent disclosure, nor is it used to limit the scope of the presentdisclosure. Other features of the present disclosure will be easilyunderstood by the following description.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings are used to better understand the presentsolution, and do not constitute a limitation to the present disclosure.

FIGS. 1-3 are schematic diagrams of problems such as intersection ornon-fitting present in 3D modeling according to the embodiments of thepresent disclosure.

FIG. 4 is a schematic flow diagram of a method for adjusting a targetobject according to the embodiments of the present disclosure.

FIG. 5 is a schematic flow diagram of a method for adjusting a targetobject according to the embodiments of the present disclosure.

FIG. 6 is a schematic flow diagram of a method for adjusting a targetobject according to the embodiments of the present disclosure.

FIG. 7 is a schematic flow diagram of an application example of a methodfor adjusting a target object according to the embodiments of thepresent disclosure.

FIG. 8 is a schematic diagram of a 3D bounding box of an applicationexample of a method for adjusting a target object according to theembodiments of the present disclosure.

FIGS. 9-13 are schematic diagrams of multi-dimensional adjustment of anapplication example of a method for adjusting a target object accordingto the embodiments of the present disclosure.

FIG. 14 is a schematic diagram of a structural composition of anapparatus for adjusting a target object according to the embodiments ofthe present disclosure.

FIG. 15 is a block diagram of electronic device for implementing amethod for adjusting a target object according to the embodiments of thepresent disclosure.

DETAILED DESCRIPTION

Hereinafter, descriptions to the exemplary embodiments of the presentdisclosure are made with reference to the accompanying drawings, includevarious details of the embodiments of the present disclosure tofacilitate understanding, and should be considered as merely exemplary.Therefore, those having ordinary skill in the art should realize,various changes and modifications may be made to the embodimentsdescribed herein, without departing from the scope and spirit of thepresent disclosure. Likewise, for clarity and conciseness, descriptionsof well-known functions and structures are omitted in the followingdescriptions.

The term “and/or” herein only describes an association relation ofassociated objects, which indicates that there may be three kinds ofrelations, for example, A and/or B may indicate that there is only Aexists, or there are both A and B exist, or there is only B exists. Theterm “at least one” herein indicates any one of many items, or anycombination of at least two of the many items, for example, at least oneof A, B, or C may indicate any one or more elements selected from a setof A, B, and C. The term “first” and “second” herein indicate aplurality of similar technical terms and use to distinguish them fromeach other, but do not limit an order of them or limit that there areonly two items, for example, a first feature and a second featureindicate two types of features/two features, a quantity of the firstfeature may be one or more, and a quantity of the second feature mayalso be one or more.

In addition, in order to better illustrate the present disclosure,numerous specific details are given in the following specificimplementations. Those having ordinary skill in the art should beunderstood that the present disclosure may be performed without certainspecific details. In some examples, methods, means, elements andcircuits well known to those having ordinary skill in the art are notdescribed in detail, in order to highlight the subject matter of thepresent disclosure.

3D vector data is a basis of large-scale 3D modeling, and may be used tosupport requirements of visual rendering and business query statisticsof intelligent transportation and intelligent cities. A road sign and asupport of the road sign are important part of the 3D modeling. The 3Dmodeling has corresponding bounding boxes for the road sign and thesupport of the road sign, and then a position and an angle of eachbounding box are adjusted manually.

Since each bounding box is independent of each other, there may be anerror in identification for the road sign and the support of the roadsign. There may be a large number of problems such as intersection andnon-fitting, if the road sign and the support of the road sign are 3Dmodeled directly based on the bounding boxes. Furthermore, manualadjustment in the 3D space has high cost, is not conductive to massproduction, and also has a poor adjustment effect.

FIGS. 1-3 are schematic diagrams of problems such as intersection ornon-fitting present in 3D modeling. As shown in FIG. 1 , a sign 101intersects with a gantry 102 that is a support of the sign. As shown inFIG. 2 , a sign 201 does not fit a rod 202 that is a support of the sign(i.e., there is a hollow between the sign 201 and the rod 202). As shownin FIG. 3 , a sign 301 does not fit a rod 302 that is a support of thesign (i.e., there is a gap between the sign 301 and the rod 302 due tothe non-fitting).

According to the embodiments of the present disclosure, a method foradjusting a target object is provided. FIG. 4 is a schematic flowdiagram of the method for adjusting the target object according to theembodiments of the present disclosure. The method may be applied to anapparatus for adjusting a target object. For example, the apparatus maybe deployed in a terminal, a server or other processing device in asingle machine, multi-machines, or a cluster system, and may realize aprocess such as adjustment of the target object. The terminal may be auser equipment (UE), a mobile device, a personal digital assistant(PDA), a handheld device, a computing device, an on-board device, awearable device, or the like. In some possible implementations, themethod may also be implemented by a processor calling acomputer-readable instruction stored in a memory. As shown in FIG. 4 , aflow of the method includes the followings.

In S401, a first bounding box corresponding to the target object and asecond bounding box corresponding to a support of the target object areacquired.

In S402, an association relationship for adjustment of the target objectis obtained, according to a spatial position where the first and secondbounding boxes are located.

In S403, the target object is moved towards the support according to theassociation relationship, to obtain a third bounding box correspondingto the adjusted target object, and the third bounding box and the secondbounding box appear to fit each other.

In an example of S401-S403, a plurality of bounding boxes are includedin the 3D modeling, and at least include the first bounding boxcorresponding to the target object, such as a sign, an indicator board,a speed limiting board, and the second bounding box corresponding to thesupport of the target object, such as a gantry, a cross rod, a verticalrod. The first and second bounding boxes may have a 3D form, thus theassociation relationship for the adjustment of the target object, suchas a relative position or angle between the first and second boundingboxes, is obtained according to the spatial position where the first andsecond bounding boxes are located.

With the present disclosure, the first bounding box corresponding to thetarget object and the second bounding box corresponding to the supportof the target object may be acquired to obtain the associationrelationship for the adjustment of the target object according to thespatial position where the first and second bounding boxes are located.The target object may be moved towards the support according to theassociation relationship to obtain the third bounding box correspondingto the adjusted target object, and the third bounding box and the secondbounding box appear to fit each other. Since the target object in the 3Dmodeling may be accurately adjusted, an effect that the bounding box ofthe target object and the bounding box of the support of the targetobject fit each other may be achieved.

According to the embodiments of the present disclosure, the method foradjusting the target object is provided. FIG. 5 is a schematic flowdiagram of the method for adjusting the target object according to theembodiments of the present disclosure. As show in FIG. 5 , a flow of themethod includes the followings.

In S501, 3D point cloud data is acquired.

In some examples, the 3D point cloud data may be obtained through pointcloud fusion processing.

In S502, feature points in the 3D point cloud data respectivelycorresponding to the target object and the support are identified byusing a feature matching manner.

In some examples, the feature points in the 3D point cloud data that arerespectively corresponding to the target object and the support areidentified, by using a feature matching manner for point cloud featurepoints in the 3D point cloud data.

In S503, the target object and the support of the target object areidentified according to the feature points respectively corresponding tothe target object and the support.

In some examples, the target object may be the sign, the indicatorboard, the speed limiting board, or the like, and the support may be thegantry, the cross rod, the vertical rod, or the like.

In S504, the first bounding box is generated for the target object, andthe second bounding box is generated for the support.

In S505, the first bounding box corresponding to the target object andthe second bounding box corresponding to the support are acquired.

In some examples, a plurality of bounding boxes are included in the 3Dmodeling, and at least include the first bounding box corresponding tothe target object and the second bounding box corresponding to thesupport of the target object.

In S506, the association relationship for the adjustment of the targetobject is obtained according to the spatial position where the first andsecond bounding boxes are located.

In some example, the first and second bounding boxes may have a 3D form,and thus the association relationship for the adjustment of the targetobject may be obtained according to the spatial position where the firstand second bounding boxes are located.

In S507, the target object is moved towards the support according to theassociation relationship to obtain the third bounding box correspondingto the adjusted target object, and the third bounding box and the secondbounding box appear to fit each other.

In some examples, the association relationship may include a posturesuch as the relative position or angle between the first and secondbounding boxes.

In some examples, in addition to adjusting the posture such as therelative position or angle between the first and second bounding boxes,adjustment processing such as enlarging or reducing may be conducted onthe form of the first and second bounding boxes according to therequirement of rendering.

With the embodiments of the present disclosure, the target object andthe support in the 3D point cloud data may be accurately identified. Inthe case where the first and second bounding boxes have the 3D form, theassociation relationship for the adjustment of the target object may beobtained through the spatial position where the first and secondbounding boxes are located, so as to the target object may beautomatically and accurately adjusted according to the associationrelationship, thereby making the target object and the support of thetarget object do not intersect or overlap, and achieving the effect thatthe bounding boxes respectively corresponding to the target object andthe support of the target object fit each other.

According to the embodiments of the present disclosure, the method foradjusting the target object is provided. FIG. 6 is a schematic flowdiagram of the method for adjusting the target object according to theembodiments of the present disclosure. As show in FIG. 6 , a flow of themethod includes the followings.

In S601, the first bounding box corresponding to the target object andthe second bounding box corresponding to the support of the targetobject are acquired.

In some examples, a plurality of bounding boxes are included in the 3Dmodeling, and at least include the first bounding box corresponding tothe target object and the second bounding box corresponding to thesupport of the target object.

In S602, the spatial position under a 3D coordinate system of the firstand second bounding boxes is projected to a planar position under atwo-dimensional (2D) coordinate system, according to a coordinatemapping relationship representing transformation from the 3D coordinatesystem to the 2D coordinate system, to obtain a relative position or arelative angle between the first and second bounding boxes at the planarposition.

In some examples, the initial form of the first and second boundingboxes may be the 3D form. In order to improve processing efficiency, thedata dimension may be reduced, so that the initial form of the first andsecond bounding boxes is projected to a target form which may be a 2Dform. For example, a bounding box in the 3D form may be orthogonallyprojected from 3D to 2D to obtain a bounding box in the 2D form. Inother words, by orthogonally projecting the first and second boundingboxes from the 3D form to the 2D form, at the planar position under the2D coordinate system, it may not only conduct the adjustment moreconveniently, but also reduce operation cost and improve operation speedcompared with the adjustment under the 3D coordinate system.

In S603, the relative position or the relative angle between the firstand second bounding boxes are determined as the associationrelationship.

In S604, the target object is moved towards the support according to theassociation relationship, to obtain the third bounding box correspondingto the adjusted target object, and the third bounding box and the secondbounding box appear to fit each other.

In some examples, the association relationship may include a posturesuch as the relative position or angle between the first and secondbounding boxes.

In some examples, in addition to adjusting the posture such as therelative position or angle between the first and second bounding boxes,adjustment processing such as enlarging or reducing may be conducted onthe form of the first and second bounding boxes according to therequirement of rending.

With the embodiments of the present disclosure, the first and secondbounding boxes may be transformed from the initial 3D form to the target2D form, so as to achieve a goal of reducing the data dimension. Afterreducing the data dimension, by adjusting the target object according tothe association relationship at the planar position under the 2Dcoordinate system, it may not only conduct the adjustment moreconveniently, but also reduce the operation cost and improve theoperation speed compared with the adjustment under the 3D coordinatesystem.

Based on an implementation of the above embodiments, the method furtherincludes establishing parent and child types between the first andsecond bounding boxes. The first bounding box is determined as the childtype, and the second bounding box is determined as the parent type.

In some examples, since the target object such as the sign, theindicator board, and the speed limiting board, and the support of thetarget object such as the gantry, the cross rod, and the vertical rodare calculated by a numerical value, a type, an identification, and thelike, in computer operation, in order to adjust the target object moreaccurately, it may distinguish whether a current object is the targetobject or the support of the target object by the type. The type usedfor distinguishing may be the parent and child types. The first boundingbox of the target object has the child type, and the second bounding boxof the support has the parent type, so that the target object may bealigned to the support by taking the support as a reference object, andthe target object and the support are aligned with each other at therelative position or angle, thereby achieving an effect of fitting.

Based on an implementation of the above embodiments, the method furtherincludes determining the support as the reference object for theadjustment of the target object, according to the parent and childtypes. With the embodiments of the present disclosure, by determiningthe reference object before adjusting the target object, the targetobject may be automatically calibrated during the subsequent adjustmentof the target object. In a case where the reference object is thesupport, the target object is aligned to the support, and the targetobject and the support are aligned with each other at the relativeposition or the relative angle.

Based on an implementation of the above embodiments, moving the targetobject towards the support according to the association relationship toobtain the third bounding box corresponding to the adjusted targetobject includes: moving the target object towards the support determinedas the reference object, according to the association relationship. Theadjustment processing for aligning the target object with respect to thesupport is performed in at least one dimension direction among front andback, left and right, or up and down, until the third bounding box andthe second bounding box appear to fit each other. With theimplementation, the support may be taken as the reference object, thetarget object may be aligned to the support, and they are aligned witheach other at the relative position or the relative angle. Furthermore,the adjustment is conducted on the target object in at least onedimension direction among front and back, left and right, or up anddown, rather than only in one dimension direction, until the thirdbounding box and the second bounding box appear to fit each other. Withthe adjustment in at least one dimension direction, calibration isconducted in one dimension direction or jointly conducted in multipledimension directions according to the requirement of rendering, so as tosatisfy requirements of rendering of different scenes.

Considering that in the related art, the 3D modeling is directlyperformed based on the bounding boxes, it is not only inaccurate, butalso costly to conduct subsequent manual adjustment and calibration in a3D scene. With the above embodiments of the present disclosure, theassociation relationship between the plurality of bounding boxes whichat least include the first bounding box corresponding to the targetobject and the second bounding box corresponding to the support may beautomatically calculated through the spatial position, so that therelative position or angle among the plurality of bounding boxes may beautomatically adjusted according to the association relationship.Through the accurate adjustment, the cost is reduced, the accuracy isimproved, and an effect that the target object and the support fit eachother is achieved.

In an application example, as shown in FIG. 7 , a flow of the adjustmentof the target object includes the followings.

In S701, the sign and the support of the sign such as the gantry, thecross rod, the vertical rod, are identified through point cloud,rectangular bounding boxes are generated, and the parent and child typesof the bounding boxes are distinguished.

In some examples, the first bounding box corresponding to the sign mayhave the child type of the parent and child types, and is recorded as achild bounding box, and the second bounding box corresponding to thesupport carrying the sign may have the parent type of the parent andchild types, and is recorded as a parent bounding box.

In some examples, a plane of the bounding box opposite to a drivingdirection of the road may be recorded as a front plane which is shown asa plane defined by vertexes “A-B-F-H” in FIG. 8 , an edge of thebounding box perpendicular to the road may be recorded as a long edge,and an edge of the bounding box parallel to the road may be recorded asa short edge. It is defaulted that pitch angles of all bounding boxesare 0, that is, all bounding boxes are parallel to the ground. It shouldbe noted that an order of vertexes of the 3D bounding box as shown inFIG. 8 is set to clarify a 2D plane to which the sign will be projectedafter the bounding box having the 3D form is transformed from the 3Dcoordinate system to the 2D coordinate system, and each 2D plane may beidentified by corresponding four vertexes, for example, the sign isprojected to a plane defined by vertexes “A-B-C-D”, that is a planealong a road direction.

In S702, the bounding box having the 3D form is orthogonally projectedto a 2D plane through data dimension reduction, to obtain theassociation relationship for the adjustment of the target object.

In some examples, as shown in FIG. 9 , with respect to the bounding boxin a top view angle, an association relationship between the supportsuch as the cross rod or the vertical rod and each sign, as well as arelative position between respective signs, may be determined throughthe parent and child types and the spatial position. A combination 1represents a first sign and its bounding box, and a combination 2represents a second sign and its bounding box. For example, a boundingbox of the cross rod is expanded by 0.5 m, and a sign intersecting thecross rod is determined to be associated with the cross rod. Forexample, a bounding box of the vertical rod is expanded by 0.5 m, and asign intersecting the vertical rod is determined to be associated withthe vertical rod. The cross rod intersecting the vertical rod isdetermined to be associated with the vertical rod, and the signintersecting the cross rod is determined to be associated with the crossrod.

In some examples, when there is overlap between respective signs, anupper and lower relationship may be determined through elevation values.A multi-level layer by layer association is conducted by associating anupper sign having a large elevation value with a lower sign having asmall elevation value, and a relative position relationship between theupper and lower signs is recorded.

In S703, an angle or positon of the sign relative to the support isautomatically adjusted through the association relationship for theadjustment of the sign, to ensure that the sign and the support fit eachother in front, rear, left and right dimensions.

In some examples, as shown in FIG. 10 , adjustment for the angle such asa heading angle may be adjustment of the heading angle of the childbounding box, so that the heading angle of the child bounding box isconsistent with that of the parent bounding box, and projection planesof the child and parent bounding boxes are parallel to each other. InFIG. 10 , the dotted line represents a calibration angle after theadjustment, and the solid line represents an offset angle with an errorbefore the adjustment. That is, a centerline in a direction of a centerpoint of each bounding box needs to be matched to a position of thedotted line, from an arrow direction before the adjustment, so as toreach the calibration angle after the adjustment, that is, the arrowdirection of the center point of each bounding box is adjusted to adownward vertical direction.

In some examples, for the processing of front and back fitting, as shownin FIG. 11 a and FIG. 11 b , an adjustment distance for fitting the signmay be calculated through a width value W of the bounding box, andadjustment methods of single-level association and multi-levelassociation are included.

As shown in FIG. 11 a , with respect to the adjust method ofsingle-level association, an adjustment principle of achieving theeffecting of fitting lies in that a vertical distance d between thecenter points of the parent and child bounding boxes is a half of a sum(W+W1) of widths of the parent and child bounding boxes, or a half of asum (W+W2) of widths of the parent and child bounding boxes. Taking theparent bounding box as the reference object, the child bounding box ofthe sign associated with the parent bounding box is moved forward orbackward a vertical moving distance Δd.

As shown in FIG. 11 b , with respect to the adjust method of multi-levelassociation, which differs from the FIG. 11 a , the plurality of signson the support intersects with each other or do not fit each other, andthe adjustment principle of achieving the effecting of fitting lies inthat in that a vertical distance d between the center points of theparent and child bounding boxes is a half of a sum (W+W1) of widths ofthe parent and child bounding boxes, or a half of a sum (W+W2) of widthsof the parent and child bounding boxes, and a vertical distance d1between the center points of the child bounding boxes which verticallyassociate with each other is a half of a difference (W1−W3) of widths ofthe child bounding boxes which vertically associate with each other, ora difference (W2−W4) of widths of the child bounding boxes whichvertically associate with each other. Taking the parent bounding box andthe lower child bounding box as the reference object, the child boundingbox of the associated sign is moved forward or backward a distance Δd.In other words, in the case where the plurality of signs are taken asthe child bounding boxes, and there is a big class and small classrelationship between the child bounding boxes, the child bounding box asa small class is moved to the child bounding box as a big class, toachieve the effect of fitting, and then the child bounding box as thebig class is moved to the parent bounding box, to achieve a finalfitting effect.

In some examples, for the adjustment for the position, as shown in FIG.12 , it is determined whether left and right adjustment is requiredaccording to the recorded relative position of the upper and lowersigns. If the relative position records as requiring the left and rightadjustment, lift and right fitting shall be conducted. The adjustmentprinciple to achieve the effect of fitting lies in that left or rightalignment is performed by moving the center point of the upper childbounding box to left or right, until a vertical distance d between theupper and lower child bounding boxes is a half of a difference (L1−L2)of lengths of the bounding boxes.

In S704, a height is adjusted according to the association relationshipfor the adjustment of the sign, an orientation, and sizes of thebounding boxes, to ensure a fitting state in upper and lower dimensions.

In some examples, if the parent bounding box overlaps with the childbounding box in a vertical direction, no adjustment is required. Asshown in FIG. 13 , if there is a gap between the parent and childbounding boxes in the vertical direction, a fitting process is required,and a principle for determining that the effect of fitting is achievedlies in the followings.

A height difference is determined according to heights and the centerpoints of the parent and child bounding boxes. If d1≤(H+H1)/2, it isdetermined that the parent and child bounding boxes overlap with eachother in the vertical direction, and thus no adjustment is required. Ifd1>(H+H1)/2, it is determined that there is the gap between the parentand child bounding boxes, and thus taking the parent bounding box as thereference object, the child bounding box is moved downward, untild1≤(H1+H2)/2, where d is the height difference between the center pointsof the bounding boxes, and H is a height of the bounding box.

In some examples, as shown in FIG. 13 , the fitting process is requiredif two vertically associated child bounding boxes overlap with eachother in the vertical direction, and no adjustment is required if thereis a gap between them in the vertical direction. A principle fordetermining that the effect of fitting is achieved lies in thefollowings.

A height difference is determined according to heights and the centerpoints of the two vertically associated child bounding boxes. Ifd2≥(H1+H2)/2, it is determined that the two child bounding boxes fiteach other in the vertical direction or there is a gap between the twochild bounding boxes in the vertical direction, and thus no adjustmentis required. If d2<(H1+H2)/2, the two child bounding boxes overlap witheach other, and thus taking the lower child bounding box as thereference object, the upper child bounding box is moved upward, untild2≥(H1+H2)/2, where d is the height difference between the center pointsof the bounding boxes, and H is the height of the bounding box.

With the application example, omni-directional adjustment for theplurality of bounding boxes having the 3D form is automaticallyachieved, so as to align the target object to the support, therebyachieving the effect of fitting, shorting a period of data correction,reducing human-hours, and ensuring a refined rendering effect to a roadfacility.

According to the embodiments of the present discourse, an apparatus foradjusting a target object is provided. FIG. 14 is a schematic diagram ofa structural composition of the apparatus for adjusting the targetobject according to the embodiments of the present disclosure. As shownin FIG. 14 , the apparatus for adjusting the target object includes anacquisition module 1401 configured to acquire a first bounding boxcorresponding to the target object and a second bounding boxcorresponding to a support of the target object, a relationshipdetermination module 1402 configured to obtain the associationrelationship for adjustment of the target object, according to a spatialposition where the first and the second bounding boxes are located, andan adjustment module 1403 configured to move, according to theassociation relationship, the target object towards, to obtain a thirdbounding box corresponding to the adjusted target object, the thirdbounding box and the second bounding box appearing to fit each other.

In an implementation, the apparatus further includes an identificationmodule configured to acquire 3D point cloud data, identify featurepoints in the 3D point cloud data respectively corresponding to thetarget object and the support, by using a feature matching manner,identify the target object and the support, according to the featurepoints respectively corresponding to the target object and the support,generate the first bounding box for the target object, and generate thesecond founding box for the support.

In an implementation, the relationship determination module 1402 isconfigured to project, according to a coordinate mapping relationshiprepresenting transformation from a 3D coordinate system to a 2Dcoordinate system, the spatial position under the 3D coordinate systemof the first and second bounding boxes to a planar position under the 2Dcoordinate system, to obtain a relative position or a relative anglebetween the first and second bounding boxes at the planar position, anddetermine the relative position or the relative angle between the firstand second bounding boxes as the association relationship.

In an implementation, the apparatus further includes an establishmentmodule configured to establish parent and child types between the firstand second bounding boxes, where the first bounding box is determined asthe child type, and the second bounding box is determined as the parenttype.

In an implementation, the apparatus further includes a determinationmodule configured to determine the support as a reference object for theadjustment of the target object, according to the parent and childtypes.

In an implementation, the adjustment module 143 is configured to movethe target object towards the support determined as the referenceobject, according to the association relationship, and perform theadjustment processing for aligning the target object with respect to thesupport in at least one dimension direction among front and back, leftand right, or up and down, until the third bounding box and the secondbounding box appear to fit each other.

Acquisition, storage and application of a user's personal informationinvolved in the technical solution of the present application all complywith provisions of relevant laws and regulations, and do not violatepublic order and good customs.

According to the embodiments of the present disclosure, the presentdisclosure also provides an electronic device, a readable storage mediumand a computer program product.

FIG. 15 is a schematic block diagram of an exemplary electronic device1500 which may implement the embodiments of the present disclosure. Theelectronic device is intended to represent various forms of digitalcomputers, such as a laptop, a desktop, a workstation, a personaldigital assistant, a server, a blade server, a mainframe computer, andother suitable computers. The electronic device may also representvarious forms of mobile devices, such as a personal digital processing,a cellular phone, a smart phone, a wearable device and other similarcomputing devices. The components shown herein, their connections andrelationships, and their functions are merely examples, and are notintended to limit the implementation of the present disclosure describedand/or required herein.

As shown in FIG. 15 , the electronic device 1500 includes a computingunit 1501 that may perform various appropriate actions and processesaccording to a computer program stored in a Read-Only Memory (ROM) 1502or a computer program loaded from a storage unit 1508 into aRandom-Access Memory (RAM) 1503. Various programs and data required foran operation of electronic device 1500 may also be stored in the RAM1503. A computing unit 1501, the ROM 1502 and the RAM 1503 are connectedto each other through a bus 1504. An input/output (I/O) interface 1505is also connected to the bus 1504.

A plurality of components in the electronic device 1500 are connected tothe I/O interface 1505, and include an input unit 1506 such as akeyboard, a mouse, or the like; an output unit 1507 such as varioustypes of displays, speakers, or the like; the storage unit 1508 such asa magnetic disk, an optical disk, or the like; and a communication unit1509 such as a network card, a modem, a wireless communicationtransceiver, or the like. The communication unit 1509 allows theelectronic device 1500 to exchange information/data with other devicesthrough a computer network such as the Internet and/or varioustelecommunication networks.

The computing unit 1501 may be various general-purpose and/orspecial-purpose processing components with processing and computingcapabilities. Some examples of the computing unit 1501 include, but arenot limited to, a Central Processing Unit (CPU), a Graphics ProcessingUnit (GPU), various dedicated Artificial Intelligence (AI) computingchips, various computing units that run machine learning modelalgorithms, a Digital Signal Processor (DSP), and any appropriateprocessors, controllers, microcontrollers, or the like. The computingunit 1501 performs various methods and processing described above, suchas the above method for adjusting the target object. For example, insome implementations, the above method for adjusting the target objectmay be implemented as a computer software program tangibly contained ina computer-readable medium, such as the storage unit 1508. In someimplementations, a part or all of the computer program may be loadedand/or installed on the electronic device 1500 via the ROM 1502 and/orthe communication unit 1509. When the computer program is loaded intoRAM 1503 and executed by the computing unit 1501, one or more steps ofthe method for adjusting the target object described above may beperformed. Alternatively, in other implementations, the computing unit1501 may be configured to perform the above method for adjusting thetarget object by any other suitable means (e.g., by means of firmware).

Various implements of the system and technologies described above hereinmay be implemented in a digital electronic circuit system, an integratedcircuit system, a Field Programmable Gate Array (FPGA), an ApplicationSpecific Integrated Circuit (ASIC), Application Specific Standard Parts(ASSP), a System on Chip (SOC), a Complex Programmable Logic Device(CPLD), a computer hardware, firmware, software, and/or a combinationthereof. These various implementations may be implemented in one or morecomputer programs, and the one or more computer programs may be executedand/or interpreted on a programmable system including at least oneprogrammable processor. The programmable processor may be aspecial-purpose or general-purpose programmable processor, may receivedata and instructions from a storage system, at least one input device,and at least one output device, and transmit the data and theinstructions to the storage system, the at least one input device, andthe at least one output device.

The program code for implementing the method of the present disclosuremay be written in any combination of one or more programming languages.The program code may be provided to a processor or controller of ageneral-purpose computer, a special-purpose computer or otherprogrammable data processing devices, which enables the program code,when executed by the processor or controller, to cause thefunction/operation specified in the flowchart and/or block diagram to beimplemented. The program code may be completely executed on a machine,partially executed on the machine, partially executed on the machine asa separate software package and partially executed on a remote machine,or completely executed on the remote machine or a server.

In the context of the present disclosure, a machine-readable medium maybe a tangible medium, which may contain or store a procedure for use byor in connection with an instruction execution system, device orapparatus. The machine-readable medium may be a machine-readable signalmedium or a machine-readable storage medium. The machine-readable mediummay include, but is not limited to, an electronic, magnetic, optical,electromagnetic, infrared or semiconductor system, device or apparatus,or any suitable combination thereof. More specific examples of themachine-readable storage medium may include electrical connections basedon one or more lines, a portable computer disk, a hard disk, aRandom-Access Memory (RAM), a Read-Only Memory (ROM), an ErasableProgrammable Read-Only Memory (EPROM or a flash memory), an opticalfiber, a portable Compact Disc Read-Only Memory (CD-ROM), an opticalstorage device, a magnetic storage device, or any suitable combinationthereof.

In order to provide interaction with a user, the system and technologiesdescribed herein may be implemented on a computer that has: a displayapparatus (e.g., a cathode ray tube (CRT) or a Liquid Crystal Display(LCD) monitor) for displaying information to the user; and a keyboardand a pointing device (e.g., a mouse or a trackball) through which theuser may provide input to the computer. Other types of devices may alsobe used to provide interaction with the user. For example, feedbackprovided to the user may be any form of sensory feedback (e.g., visualfeedback, auditory feedback, or tactile feedback), and the input fromthe user may be received in any form (including an acoustic input, avoice input, or a tactile input).

The system and technologies described herein may be implemented in acomputing system (which serves as, for example, a data server) includinga back-end component, or in a computing system (which serves as, forexample, an application server) including a middleware, or in acomputing system including a front-end component (e.g., a user computerwith a graphical user interface or web browser through which the usermay interact with the implementation of the system and technologiesdescribed herein), or in a computing system including any combination ofthe back-end component, the middleware component, or the front-endcomponent. The components of the system may be connected to each otherthrough any form or kind of digital data communication (e.g., acommunication network). Examples of the communication network include aLocal Area Network (LAN), a Wide Area Network (WAN), and the Internet.

A computer system may include a client and a server. The client andserver are generally far away from each other and usually interact witheach other through a communication network. A relationship between theclient and the server is generated by computer programs running oncorresponding computers and having a client-server relationship witheach other. The server may be a cloud server, a distributed systemserver, or a block chain server.

It should be understood that, the steps may be reordered, added orremoved by using the various forms of the flows described above. Forexample, the steps recorded in the present disclosure can be performedin parallel, in sequence, or in different orders, as long as a desiredresult of the technical scheme disclosed in the present disclosure canbe realized, which is not limited herein.

The foregoing specific implementations do not constitute a limitation onthe protection scope of the present disclosure. Those having ordinaryskill in the art should understand that, various modifications,combinations, sub-combinations and substitutions may be made accordingto a design requirement and other factors. Any modification, equivalentreplacement, improvement or the like made within the spirit andprinciple of the present disclosure shall be included in the protectionscope of the present disclosure.

What is claimed is:
 1. A method for adjusting a target object,comprising: acquiring a first bounding box corresponding to the targetobject and a second bounding box corresponding to a support of thetarget object; obtaining an association relationship for adjustment ofthe target object, according to a spatial position where the first andsecond bounding boxes are located; and moving, according to theassociation relationship, the target object towards the support, toobtain a third bounding box corresponding to the adjusted target object,wherein the third bounding box and the second bounding box appear to fiteach other.
 2. The method of claim 1, further comprising: acquiring athree-dimensional (3D) point cloud data; identifying feature points inthe 3D point cloud data respectively corresponding to the target objectand the support, by using a feature matching manner; identifying thetarget object and the support, according to the feature pointsrespectively corresponding to the target object and the support; andgenerating the first bounding box for the target object and the secondbounding box for the support.
 3. The method of claim 2, whereinobtaining the association relationship for the adjustment of the targetobject, according to the spatial position where the first and secondbounding boxes are located, comprises: projecting, according to acoordinate mapping relationship representing transformation from a 3Dcoordinate system to a two-dimensional (2D) coordinate system, thespatial position under the 3D coordinate system of the first and secondbounding boxes to a planar position under the 2D coordinate system, toobtain a relative position or a relative angle between the first andsecond bounding boxes at the planar position; and determining therelative position or the relative angle between the first and secondbounding boxes as the association relationship.
 4. The method of claim1, further comprising: establishing parent and child types between thefirst and second bounding boxes, wherein the first bounding box isdetermined as the child type, and the second bounding box is determinedas the parent type.
 5. The method of claim 2, further comprising:establishing parent and child types between the first and secondbounding boxes, wherein the first bounding box is determined as thechild type, and the second bounding box is determined as the parenttype.
 6. The method of claim 3, further comprising: establishing parentand child types between the first and second bounding boxes, wherein thefirst bounding box is determined as the child type, and the secondbounding box is determined as the parent type.
 7. The method of claim 4,further comprising: determining the support as a reference object forthe adjustment of the target object, according to the parent and childtypes.
 8. The method of claim 5, further comprising: determining thesupport as a reference object for the adjustment of the target object,according to the parent and child types.
 9. The method of claim 6,further comprising: determining the support as a reference object forthe adjustment of the target object, according to the parent and childtypes.
 10. The method of claim 7, wherein moving, according to theassociation relationship, the target object towards the support, toobtain the third bounding box corresponding to the adjusted targetobject, comprises: moving the target object towards the supportdetermined as the reference object, according to the associationrelationship; and performing adjustment processing for aligning thetarget object with respect to the support in at least one dimensiondirection among front and back, left and right, or up and down, untilthe third bounding box and the second bounding box appear to fit eachother.
 11. The method of claim 8, wherein moving, according to theassociation relationship, the target object towards the support, toobtain the third bounding box corresponding to the adjusted targetobject, comprises: moving the target object towards the supportdetermined as the reference object, according to the associationrelationship; and performing adjustment processing for aligning thetarget object with respect to the support in at least one dimensiondirection among front and back, left and right, or up and down, untilthe third bounding box and the second bounding box appear to fit eachother.
 12. The method of claim 9, wherein moving, according to theassociation relationship, the target object towards the support, toobtain the third bounding box corresponding to the adjusted targetobject, comprises: moving the target object towards the supportdetermined as the reference object, according to the associationrelationship; and performing adjustment processing for aligning thetarget object with respect to the support in at least one dimensiondirection among front and back, left and right, or up and down, untilthe third bounding box and the second bounding box appear to fit eachother.
 13. An electronic device, comprising: at least one processor; anda memory connected in communication with the at least one processor;wherein the memory stores an instruction executable by the at least oneprocessor, and the instruction, when executed by the at least oneprocessor, enables the at least one processor to execute: acquiring afirst bounding box corresponding to a target object and a secondbounding box corresponding to a support of the target object; obtainingan association relationship for adjustment of the target object,according to a spatial position where the first and second boundingboxes are located; and moving, according to the associationrelationship, the target object towards the support, to obtain a thirdbounding box corresponding to the adjusted target object, wherein thethird bounding box and the second bounding box appear to fit each other.14. The electronic device of claim 13, wherein the instruction, whenexecuted by the at least one processor, enables the at least oneprocessor to further execute: acquiring a three-dimensional (3D) pointcloud data; identifying feature points in the 3D point cloud datarespectively corresponding to the target object and the support, byusing a feature matching manner; identifying the target object and thesupport, according to the feature points respectively corresponding tothe target object and the support; and generating the first bounding boxfor the target object and the second bounding box for the support. 15.The electronic device of claim 14, wherein the instruction, whenexecuted by the at least one processor, enables the at least oneprocessor to further execute: projecting, according to a coordinatemapping relationship representing transformation from a 3D coordinatesystem to a two-dimensional (2D) coordinate system, the spatial positionunder the 3D coordinate system of the first and second bounding boxes toa planar position under the 2D coordinate system, to obtain a relativeposition or a relative angle between the first and second bounding boxesat the planar position; and determining the relative position or therelative angle between the first and second bounding boxes as theassociation relationship.
 16. The electronic device of claim 13, whereinthe instruction, when executed by the at least one processor, enablesthe at least one processor to further execute: establishing parent andchild types between the first and second bounding boxes, wherein thefirst bounding box is determined as the child type, and the secondbounding box is determined as the parent type.
 17. A non-transitorycomputer-readable storage medium storing a computer instruction thereon,wherein the computer instruction is used to cause a computer to execute:acquiring a first bounding box corresponding to a target object and asecond bounding box corresponding to a support of the target object;obtaining an association relationship for adjustment of the targetobject, according to a spatial position where the first and secondbounding boxes are located; and moving, according to the associationrelationship, the target object towards the support, to obtain a thirdbounding box corresponding to the adjusted target object, wherein thethird bounding box and the second bounding box appear to fit each other.18. The non-transitory computer-readable storage medium of claim 17,wherein the computer instruction is used to cause the computer tofurther execute: acquiring a three-dimensional (3D) point cloud data;identifying feature points in the 3D point cloud data respectivelycorresponding to the target object and the support, by using a featurematching manner; identifying the target object and the support,according to the feature points respectively corresponding to the targetobject and the support; and generating the first bounding box for thetarget object and the second bounding box for the support.
 19. Thenon-transitory computer-readable storage medium of claim 18, wherein thecomputer instruction is used to cause the computer to further execute:projecting, according to a coordinate mapping relationship representingtransformation from a 3D coordinate system to a two-dimensional (2D)coordinate system, the spatial position under the 3D coordinate systemof the first and second bounding boxes to a planar position under the 2Dcoordinate system, to obtain a relative position or a relative anglebetween the first and second bounding boxes at the planar position; anddetermining the relative position or the relative angle between thefirst and second bounding boxes as the association relationship.
 20. Thenon-transitory computer-readable storage medium of claim 17, wherein thecomputer instruction is used to cause the computer to further execute:establishing parent and child types between the first and secondbounding boxes, wherein the first bounding box is determined as thechild type, and the second bounding box is determined as the parenttype.